1 Semiconductor Integrated Circuit Development
2 Basic Semiconductor Materials
3 Base Semiconductor Devices
4 Oxidation and Heating Processes
5 Lithography
6 Diffusion and Ion Implantation Process
7 Etching Process
8 Dielectric Films and Chemical Vapor Deposition
9 Metallization Process
10 CMOSFET Process Integration
11 Advanced Device Process
12 FinFET Process Integration
13 Semiconductor Materials Analysis Technology
14 GAAFET and CFET to 3D IC Heterogeneous Integration
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Yung-Chun Wu
Yung-Chun Wu earned his Ph.D. in Institute of Electronics from National Chiao Tung University in 2005. He serves in the Department of Engineering and System Science and the College of Semiconductor Research at National Tsing Hua University, Hsinchu, Taiwan. As an IEEE Senior Member, his research expertise spans semiconductor device fabrication and integration, semiconductor device physics and TCAD simulation, as well as memory process and integration. Professor Wu has published over 100 SCI-indexed journal articles, primarily in IEEE publications, and holds several U.S. patents. He authored 3D TCAD Simulation for CMOS Nanoelectronic Devices (Springer, 2017) and the Chinese textbook Semiconductor Processes and Integration (Tsang Hai, 2023).
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The text offers comprehensive coverage of state-of-the-art semiconductor technologies, including strained silicon channels, high-k dielectric gate oxide layers, metal gates, device gate design considerations, MOSFET carrier mobility, and advanced source and drain engineering.
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The text provides a detailed explanation of process integration technologies for 2D planar transistors and 3D FinFETs.
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The text provides the examples that clarify concepts and show how theory is applied.
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With over 500 illustrations, it enables readers to grasp the complexity of semiconductor manufacturing processes and techniques with greater depth and clarity.
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The book covers multiple generations of transistor architectures, including MOSFETs, FinFETs, GAAFETs, and CFETs.